We provide high level research and development services to meet your demanding requirements. Our versatile equipment is fine-tuned individually to achieve complete customer satisfaction. Short feedback loops and personal, confidential customer care are our highest priority. Please find below a list of equipment that can be put to use for you!
Nanoimprint Lithography |
EVG 770 NILStepper - 6" UV Nanoimprint Step&Repeat, reduced ambient air pressure, alignment |
EVG 620 NIL - 4"-6" Soft UV Nanoimprint for flexible templates and full wafer imprint |
EVG 501 - 1" - 4" Single step imprint system, reduced ambient air pressure |
Electron Beam Lithography |
Leica EBPG 5000 - 20/50/100 kV, sub 10 nm resolution, 6" substrates |
Raith Elphy Plus + LEO DSM 940a - 5-35kV, laser stage, 2" substrates |
Interference Lithography |
Interference Lithography Setup - 180 - 600 nm pitch, up to 6", active fringe stabilization |
Lloyd mirror interferometer - 140 - 1500 nm pitch, 2x2 cm - 4" |
Coater / Aligner |
EVG 150 - 4"-6" Automatic resist processor, coater & developer |
Wet Processors |
ARIAS Wet benches - single wafer and batch cleaning and resist processes |
SCFluids Super Critical Dryer - CO2, Semiautomatic, up to 6" substrates |
Nanequi - Automatic single wafer development tool, up to 6" substrates |
Furnaces |
Four 6" Centrotherm Furnaces: Oxidation, POCl3-Diffusion and Annealing |
Jipelec JetFirst: 6" Rapid Thermal Annealing system |
CVD (Chemical Vapour Deposition) |
Centrotherm 6" LPCVD furnaces - Polysilicon, Silicon Nitride and LTO (low temp. SiO2) |
Deposition |
2 Oxford FlexAL systems - up to 8“ plasma assisted atomic layer deposition, TiN |
Von Ardenne CS730 Cluster system - 6" DC and RF sputtering of dielectrics and metals, sputter etch |
Pfeiffer Vacuum Classic 580 - 6" e-beam and resistive evaporator, Materials: Al, Cr, Si02,Ti, Ta2O5 |
Etchers |
Roth & Rau Mircosys 400 - Automatic 2 chamber system, 6" fluorine and chlorine based chemistry |
Oxford PlasmaLab 100 - Automatic 2 chamber system, up to 8" chlorine, bromide and fluorine based chemistry |
Oxford PlasmaLab 100 - Automatic 2 chamber system, 6" chlorine and fluorine based chemistry |
Tepla Semi 300 - Microwave Plasma Etcher, batch and single wafer processes, 02 and CF4 processes |
Metrology |
LEO 982 GEMINI SEM - High resolution Low acceleration voltage SEM |
Veeco (DI) Dimension 3100 SPM - High resolution STM, AFM, MFM, up to 6" substrates |
Veeco DekTak³ST - surface profiler |
Leica INM 100 - optical microscope, 6" |
Philips PQ Ruby - Ellipsometer, 6" |
J.A. Woollam Spectroscopic Ellipsometer (M-2000U 245-1000nm) |
Electrical Testing |
Agilent Precision Impedance Analyzer (4294A) |
Cascade Microtech Semi-Automatic probe station |
Agilent Semiconductor parameter analyzer (4156B) |
Agilent pA-meter (4140B) |
Agilent Precision LCR-meter (4284A) |
