A clever way of protecting graphene

One thing that has become clear in the last decade of graphene research is that it is necessary to protect the surface of graphene from external contaminants, to preserve its exceptional electronic properties and be able to exploit them into novel devices. The depositions of dielectric materials on top of graphene is therefore an essential step of manufacturing graphene-based electronic and photonic devices. [read more »]

End of an era: AMO’s wind turbine ANIMA is dismantled

Once a pioneer in Aachen, ANIMA, the “soul” of AMO (ANIMA: Italian for soul), retires after 26 years of service. It was one of the first turbines installed in the Aachen urban area and, for a long time, the largest wind turbine commissioned by a university campus in Europe. Financed by the EU structural-aid funds for the long-term promotion of research and innovation, the plant was operated by the non-profit research foundry AMO GmbH, which had already started to look for alternative energy sources. The goal was to generate part of the energy needed for the research institute itself. [read more »]

What should the future look like?

An interview with Max Lemme over the Future-Cluster NeuroSys

In a video interview for the Faculty of Electrical Engineering and Information Technology of RWTH Aachen University, Prof. Max Lemme explains the vision behind the Future-Cluster NeuroSys, the role of neuromorphic hardware in shaping the future of artificial intelligence applications, and the necessity of addressing not only the technical aspects, but also the socio-economic implications of this new technology, to ensure that it conforms “by design” with European values. [read more »]

A scalable method for the large-area integration of 2D materials

Two-dimensional (2D) materials have a huge potential for providing devices with much smaller size and extended functionalities with respect to what can be achieved with today’s silicon technologies. But to exploit this potential we must be able to integrate 2D materials into semiconductor manufacturing lines – a notoriously difficult step. A team of researchers from Sweden and Germany now reports a new method to make this work.

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