Two-dimensional (2D) materials have a huge potential for providing devices with much smaller size and extended functionalities with respect to what can be achieved with today’s silicon technologies. But to exploit this potential we must be able to integrate 2D materials into semiconductor manufacturing lines – a notoriously difficult step. A team of researchers from Sweden and Germany now reports a new method to make this work.
Bridging the gap between lab-scale manufacturing and large volume production of electronic devices based on two-dimensional materials – this is the mission of the 2D Experimental Pilot Line, a €20 million project funded by the European Commission within the H2020 program. Its kick-off meeting is planned on October 8, 2020.