A Collaborative Research Center to Redefine the Boundaries of Chip Design
The Collaborative Research Center/Transregio TRR404 – “Next Generation Electronics with Active Devices in Three Dimensions [Active-3D]” officially began its endeavor in April 2025. The goal is to redefine the boundaries of chip design by developing novel device and integration strategies that enable the integration of active devices directly within the volume above the chip area. […]