New Technique Enables Scalable On-Chip Integration of Perovskites for Optoelectronics
Researchers at AMO GmbH and RWTH Aachen University’s Chair of Electronic Devices (ELD) have developed a versatile top-down microstructuring technique for metal-halide perovskites (MHPs), paving the way for scalable integration of these promising materials into future optoelectronic devices.
The study, titled “A Versatile Top-Down Patterning Technique for Perovskite On-Chip Integration,” introduces a method based on UV photolithography and inductively coupled plasma reactive ion etching (ICP-RIE). This approach enables:
- Feature sizes down to 1 μm
- Compatibility with 3D, 2D, and 0D perovskite compositions
- Wafer-scale reproducibility and industrial feasibility
- Preservation of phase and optical properties
This advancement opens new possibilities for monolithic integration of perovskites in optoelectronics, photonics, and energy harvesting applications using industry-standard processes.
Authors and Collaborators
The publication is co-authored by Federico Fabrizi, Saeed Goudarzi, Sana Khan, Tauheed Mohammad, Liudmila Starodubtceva, Piotr Jacek Cegielski, Felix Thiel, Sercan Özen, Maximilian Schiffer, Felix Lang, Peter Haring Bolívar, Thomas Riedl, Gerhard Müller-Newen, Surendra B. Anantharaman, Maryam Mohammadi, and Max Lemme.
Funding and Support
This work was supported by the Deutsche Forschungsgemeinschaft (DFG) within TRR404 Active-3D and the Hiper-Lase projects, the European Union’s Horizon 2020 programme (Marie Skłodowska-Curie and FOXES), the German Ministry of Education and Research (BMBF) through NEPOMUQ, and the Volkswagen Foundation (Freigeist Program). Additional support came from the Indian Institute of Technology Madras, IGSTC, and RWTH Aachen’s Confocal Microscopy Facility.
Special thanks to P. Grewe, Dr. U. Böttger, Dr. V. Morad, and Prof. M. Kovalenko for their contributions.
📄 Read the full publication here: ACS Applied Materials & Interfaces
