New Publication: Improved Heat Dissipation in CsPbBr₃-hBN Heterostructures

Metal halide perovskites hold great potential for future optoelectronic and photonic devices. However, one of their key challenges is their low thermal conductivity, which can limit device performance and long-term stability, particularly under high excitation powers.

In the newly published study, the researchers demonstrate that this challenge can be significantly reduced by introducing an ultrathin layer of few-layer hexagonal boron nitride (hBN). Acting as a transparent heat-spreading layer, the hBN capping layer increases the effective thermal conductivity of the CsPbBr₃ structures by a factor of seven, from 0.43 to 3.0 W/(m·K). At the same time, the area of damage caused by high laser powers was reduced by a factor of nine. Thermal diffusion simulations further confirm faster heat spreading and more efficient cooling within the heterostructures.

Particularly noteworthy is that these improvements were achieved using a semi-dry transfer process for 2D materials without compromising the morphology or optical properties of the underlying perovskite. The results clearly demonstrate how two-dimensional materials can provide additional functionalities for emerging semiconductor platforms.

The work was carried out as part of a successful collaboration between RWTH Aachen University, AMO, and the University of Wuppertal. In addition to Liudmila Starodubtceva, Ahmed Kadid, Naho Kurahashi, Cedric Kreusel, Jasper Ruhkopf, Sebastian Lukas, Ulrich Plachetka, Ralf Heiderhoff, Thomas Riedl, Maryam Mohammadi, and Max Lemme contributed to the study.

We are pleased to have contributed to this promising research and congratulate the entire team on this successful publication.

The article was published in Materials Advances and can be accessed here.