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WiPLASH

You are here: Home1 / Graphene Electronics2 / WiPLASH

01.10.2019 — 30.09.2023

WiPLASH

Architecting More Than Moore – Wireless Plasticity for Heterogeneous Massive Computer
Architectures

Förderer Funding Agency: EU

Förderkennzeichen Grant ID: 863337

New on-chip wireless communication plane

Future wireless communication systems and computing platforms need to deliver much higher data rates, more flexibility, and a significantly higher energy efficiency than current systems. As heterogeneous processors are widely available, new platforms are required to leverage a huge amount of computing power. To ensure near-ASIC (application-specific integrated circuit) efficiency without the cost, development time or limitations, the EU-funded WiPLASH project is developing an on-chip wireless communication plane to provide architectural plasticity, reconfigurability and adaptation for any application requirements without any loss of generality. Specifically, the project will design a miniaturised and tuneable graphene antenna prototype in the terahertz band. It will also co-integrate graphene RF components with submillimetre-wave transceivers and demonstrate low-power reconfigurable wireless chip-scale networks.

https://cordis.europa.eu/project/id/863337

 

 

Kontakt

Dr. Zhenxing Wang

https://www.linkedin.com/in/zhenxing-wang-89015748/
Group Leader - Graphene Electronics


Website

www.zurich.ibm.com

Industrial Partners

  • IBM Research Zürich (CH)

Academic Partners

  • Universitat Politècnica de Catalunya (ES)
  • EPFL (CH)
  • RWTH Aachen University (DE)
  • Universitäte Siegen (DE)
  • Università di Bologna (IT)

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