Cleanroom Facilities

AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m²: Nanolab AMICA. Here, high end fabrication equipment for semiconductor technology is operated in a highly flexible way to enable high quality nanofabrication, quick process changes and unconventional solutions.

AMO is, as a matter of principle, a R&D company with several research and development projects within a lot of different research fields and offers high flexibility regarding customer orders. This is based on 20 years of experience in micro- and nanotechnology. As a result, we are not organized like a big wafer fab, AMO is in fact organized in a way that for all customers and partners the best individual solution is found, with low processing times and lot sizes matching the customer’s needs. Thereby, great attention is paid to the customer’s satisfaction.

AMO’s business focuses inter alia:

• Fabrication of nanophotonic components on prototype and small-scale level
• Nanostructuring-services
• Cleanroom-Services

All the listed euipment below is made available to interested customers and partners in the framework of our services branch. For a concrete proposal please do not hesitate to make direct contact for a tailor-made solution combining all the necessary tools and processes meeting your specific demands.

Nanostructuring

The exploitation of the enabling potentials of nanotechnology for the fabrication of novel functional components depends critically on the availability of advanced lithography methods and their continuous improvement. AMICA is designed to be a nanolithography center. The established lithography technology was designed to meet application specific parameters, such as minimum feature size, exposure area and design flexibility. Today, AMO is able to offer a variety of lithography-technologies as follows:

Deposition

For deposition of high quality thin films, dielectrics and metals, AMO offers a wide range of different techniques enabling thicknesses of the deposited or grown material layer from several angstroms to some microns.

Furnaces

AMO has different furnaces available, used at different stages along the process flow for high quality micro- and nanoelectronic devices, ranging from growing high quality silicon oxides to high temperature annealing.

• Four 6″ – 8″ Centrotherm Furnaces:
  • Oxidation (wet and dry oxides)
  • POCl₃-Diffusion
  • Annealing
• Jipelec JetFirst:
  • 6″ Rapid Thermal Annealing system

Wet Processing

Wet processing is carried out in dedicated areas for handling wet chemicals including areas with amber light for handling lithography resists. To allow for a maximum of flexibility of processable substrates wet benches and tools are provided to handle wafer pieces, single wafers as well as wafer batches.

• ARIAS Wet benches:
  • single wafer and batch cleaning and resist processes
• SCFluids Super Critical Dryer:
  • CO₂, semi-automatic, up to 6″ substrates

Metrology

In order to ensure process control and device characterization AMO has different measurement equipment available, for measuring diverse parameters, during processing as well as on the finished device. Typical parameters of interest during process control are e.g. layer thickness, layer roughness, layer composition, lateral dimensions and distances.

• Zeiss Supra 60 VP
  • EDX High resolution SEM with automated CD control module
  • up to 8″ substrates
• Veeco (DI) Dimension 3100 SPM:
  • high resolution STM, AFM, MFM,
  • up to 6″ substrates
• Veeco DekTak³ST surface profiler
• Leica INM 100 and INM 300: optical microscopes, up to 6″ substrates
• Philips PQ Ruby Ellipsometer, up to 8″ substrates
• J.A. Woollam spectroscopic Ellipsometer (M-2000U 245-1000nm)

To verify device characteristics, both electrical and optical, AMO offers testing facilities to cover these demands. Measurement capabilities comprise the following: