Cleanroom Facilities

AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m²: Nanolab AMICA. Here, high end fabrication equipment for semiconductor technology is operated in a highly flexible way to enable high quality nanofabrication, quick process changes and unconventional solutions.

AMO is, as a matter of principle, a R&D company with several research and development projects within a lot of different research fields and offers high flexibility regarding customer orders. This is based on 20 years of experience in micro- and nanotechnology. As a result, we are not organized like a big wafer fab, AMO is in fact organized in a way that for all customers and partners the best individual solution is found, with low processing times and lot sizes matching the customer’s needs. Thereby, great attention is paid to the customer’s satisfaction.

AMO’s business focuses inter alia:

  • Fabrication of nanophotonic components on prototype and small-scale level
  • Nanostructuring-services
  • Cleanroom-Services

All the listed euipment below is made available to interested customers and partners in the framework of our services branch. For a concrete proposal please do not hesitate to make direct contact for a tailor-made solution combining all the necessary tools and processes meeting your specific demands.


The exploitation of the enabling potentials of nanotechnology for the fabrication of novel functional components depends critically on the availability of advanced lithography methods and their continuous improvement. AMICA is designed to be a nanolithography center. The established lithography technology was designed to meet application specific parameters, such as minimum feature size, exposure area and design flexibility. Today, AMO is able to offer a variety of lithography-technologies as follows:


  • Vistec EBPG 5200 e-beam system:CR2.tif
    • 50/100 kV
    • sub 10 nm resolution
    • from samples of 10×10 mm² up to 8″ wafers
  • Canon FPA 3000 i5r i-line Stepper with 0,5 μm resolution
  • EVG 420 6″ semi-automatic CR3.tifMaskaligner
  • EVG 150: 4″- 8″ automatic resist coater and developer
  • Süss MA8 Gen3 SCIL 2″-8″ UV-Nanoimprint Lithography
  • EVG 770 4″- 8″ UV-Nanoimprint Step&Repeat Lithography
  • EVG 620 Soft UV Nanoimprint prototype:
    4″- 6″ flexible template size, sub 50 nm resolution
  • 2 experimental Interference Lithography systems:
    180 nm – 2.5 μm pitch, up to 8″ substrates, stitching free


CR4The highly developed nanolithography is embedded in a CMOS compatible pattern transfer for silicon substrates. The whole process chain is continually refined and adapted to the visionary demands of a steadily changing market.

  • Oxford PlasmaLab 100:
    • 3 automatic chamber system, up to 8″ substrates
    • chlorine, fluorine and bromine based chemistry
  • Tepla Semi 300:
    • Microwave Plasma Etcher, batch and single wafer processes
    • O2 and CF4 processes


For deposition of high quality thin films, dielectrics and metals, AMO offers a wide range of different techniques enabling thicknesses of the deposited or grown material layer from several angstroms to some microns.

CVD (Chemical Vapour Deposition)

The substrate is exposed to reactive gases which decompose and react on the substrate surface forming the desired deposit. By using low pressure (sub-atmospheric) unwanted gas phase reactions are reduced and the film thickness uniformity is enhanced.

  • Centrotherm 6″ LPCVD furnaces
    • Polysilicon
    • Silicon Nitride
    • LTO (low temp. SiO2)

Atomic Layer Deposition

The adequate solution for very thin, conformal films with perfect control of the thickness and layer composition is the atomic layer deposition (ALD). The involved precursors react sequentially in a self-limited way with the surface to form the desired film.

  • 2 Oxford FlexAL Plasma assisted ALD tools
    • up to 8″ substrates
    • Materials: AlN, Al2O3, TaN, TiN

Sputtering / Evaporators

In contrast to CVD methods, sputtering and CR5evaporation are PVD (physical vapour deposition) methods. The material vapour here is generated physically either via collision ionization (sputtering) or via heating (evaporator). The material vapour condensates on the substrate forming the desired deposit.

  • Von Ardenne CS730 Cluster sputter system:
    • 6″ DC and RF
    • Materials: W, Ni, Ti, TiN, Al, AlSi, AlCr, SiO2, Ta2O5, Al2O3, HfO2, etc.
  • Pfeiffer Vacuum Classic 580:
    • 6″ e-beam and resistive evaporator
    • Materials: Al, Cr, SiO2, Ti, Ta2O5, etc.


AMO has different furnaces available, used at different stages along the process flow for high quality micro- and nanoelectronic devices, ranging from growing high quality silicon oxides to high temperature annealing.

  • Four 6″ – 8″ Centrotherm Furnaces:CR6
    • Oxidation (wet and dry oxides)
    • POCl3-Diffusion
    • Annealing
  • Jipelec JetFirst:
    • 6″ Rapid Thermal Annealing system

Wet Processing

Wet processing is carried out in dedicated areas for handling wet chemicals including areas with amber light for handling CR7lithography resists. To allow for a maximum of flexibility of processable substrates wet benches and tools are provided to handle wafer pieces, single wafers as well as wafer batches.

  • ARIAS Wet benches:
    • single wafer and batch cleaning and resist processes
  • SCFluids Super Critical Dryer:
    • CO2, semi-automatic, up to 6″ substrates


In order to ensure process control and device characterization AMO has different measurement equipment available, for measuring diverse parameters, during processing as well as on the finished device. Typical parameters of interest during process control are e.g. layer thickness, layer roughness, layer composition, lateral dimensions and distances.

  • Zeiss Supra 60 VP
    • EDX High resolution SEM with automated CD control moduleSilizium_Master_Stempel
    • up to 8″ substrates
  • Veeco (DI) Dimension 3100 SPM:
    • high resolution STM, AFM, MFM,
    • up to 6″ substrates
  • Veeco DekTak³ST surface profiler
  • Leica INM 100 and INM 300: optical microscopes, up to 6″ substrates
  • Philips PQ Ruby Ellipsometer, up to 8″ substrates
  • J.A. Woollam spectroscopic Ellipsometer (M-2000U 245-1000nm)

To verify device characteristics, both electrical and optical, AMO offers testing facilities to cover these demands. Measurement capabilities comprise the following:

Electrical Testing

  • High end Parameter analyzer for small signal DC nanoelectronic device testing
  • Cascade Microtech semi-automatic probe station
  • Agilent Precision impedance analyzer (4294A)
  • Agilent Semiconductor parameter analyzer (4156B)
  • Agilent pA-meter (4140B)
  • Agilent Precision LCR-meter (4284A)

Optical Testing

  • Silicon Photonics device testingCR8
    • @1300 nm and 1550 nm
    • tunable laser
    • fiber & butt coupled