The technology transfer from the laboratory to innovative fabrication sites is one of the major pillars in the mission of AMO.

Transfer of Key Enabling Technologies to Innovations

The transfer of key enabling technologies (KET) accumulated in AMICA, the nano laboratory of AMO GmbH, in past and current research projects to innovative groups at University and industries is therefore of major interest.

Traditionally, technology transfer takes place within three routes:

  • with AMO as an ordinary partner in a consortium for funded projects
  • with AMO as a subcontractor within diverse R&D projects
  • within joint developments with innovative partners

For all these partners AMO offers the perfect equipped CMOS-Cleanroom.

In the following list processes and products currently offered to partners and customers are summarized:

Advanced lithography

A great amount of requests comprising the use of AMO’s advanced lithography targets the manufacturing of masters and templates used for imprinting purposes.

By utilizing all available cleanroom equipment AMO offers a highly flexible platform for processing templates. The specifically used lithography technique depends on the requested minimum feature size, pitch and other specific parameters of the master.

Available lithography tools are:

  • i-line lithography
  • Interference lithography
  • Electron beam lithography

The structures are then transferred into the substrate via Reactive Ion Etching.

Other fields of application of advanced lithography comprise the processing of structures with a very low required minimum feature size, which is typically required for the highly accurate and flexible fabrication for nanoelectronics & nanophotonics. These demands are satisfied by the usage of the e-beam lithography.

For more details on the possibilities in this realm please refer to the corresponding FactSheets (“Masters and Stamps” and “E-Beam Lithography“) in the sidebar on the right-hand side.

Active and passive photonic components


AMO offers research, development and small scale production of silicon nanophotonic devices and circuits. AMO´s advanced baseline processes cover a wide range from single passive nanophotonic chips up to 6” wafer processing with active nanophotonic devices and two-level metal interconnects.

Currently following components/ processes are commercially available:

  • Passive Components
    • Processes for strip, ridge, slotted and combined technology waveguides
    • Low loss waveguides
    • Resonators
    • Fiber-to-chip coupling
  • Active Components
    • Processes for n+ and p+ doping and metal interconnects and processes for integrated micro heaters based on titanium
    • Heaters
    • Modulators
    • IR detectors

A summary of details can be found in the corresponding FactSheet “Nanophotonics” in the sidebar on the right-hand side.

Graphene flakes and devices

AMO GmbH can offer solutions adapted to your demands for different fields of applications with the following product portfolio:

Graphene Flakes
Mechanically exfoliated graphene-flakes are ideally suiting for applications in fundamental and applied science where highest crystalline quality is required and a low crystallite size can be accepted.

Graphene Devices
AMO offers the fabrication of graphene transistors and can also support your own process development as part of its Graphene Foundry Services.

Catalytic Graphene
Catalytically produced graphene is appropriate for all areas in which large-scaled graphene is needed, such as transparent electrodes or functional coatings.

AMO offers different custom-made substrates to facilitate your research with graphene.

Details to every single above mentioned point can be found in the corresponding FactSheet “Graphene” in the sidebar on the right-hand side.

CMOS device prototyping

The transition from micro- to nanoscale CMOS is the major challenge for the semiconductor industry during the next decade. Simple downscaling of device dimensions may not be sufficient to achieve the ambitious goals set by the Semiconductor Industry Association (SIA).

Since the beginning of the year 2000 AMO has been involved in several projects focussing on different aspects of CMOS technology, ranging from new transistor concepts for end of roadmap scaling to devices with new materials like high-k gate dielectrics, metal gates and silicides.

The team at AMO has developed a flexible CMOS process platform that can be fine tuned for a variety of research and development applications.

If you are looking for an experienced partner to demonstrate SOC feasibility in bio-chips, sensor-applications or MEMS/NEMS, we are the right address!

Available technology modules and products:

  • High resolution nanoelectronic transistor fabrication
  • SOI CMOS process for device studies and end of roadmap transistors
  • Versatile platform technology
  • Flexible integration of new materials
  • Electronic sensor fabrication
    • Nanoscale electronic devices for ultrasensitive sensors
    • Platform for advanced gas and bio sensors
    • Prototyping and small volume production

Please refer to the corresponding FactSheet “CMOS” in the sidebar on the right-hand side.