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Micro- and Nanotechnology Foundry Services

If you are looking for an experienced partner to demonstrate Micro- and Nanotechnology for your application we are the right people to contact!

We can look back at a large number of successfully carried out public funded projects as well as a growing number of direct industry cooperations.

We provide “total technology support” in Micro- and Nanotechnology, Semiconductor technology and electronics, Photonics and Optics, Nanopatterned Substrates for Biotechnology and many more

  

We are the ideal partner for

  • technology development
  • semiconductor device processing development
  • outsourcing semiconductor, micro- and nanotechnology
  • small volume manufacturing up to 6”
  • master and template fabrication
  • and many more

If you are interested in our processing and technology services
please fill in the request form or contact us directly.

 

Electron Beam Lithography Services

AMO offers a wide range of readily available EBL processes on many different substrate types, substrate sizes and applications. This includes processes for both positive and negative tone resists (PMMA, ZEP 520A, HSQ). Processes suitable to be followed by a RIE etching or a lift-off process, both also offered by AMO, are at hand. For the fabrication of high aspect ratio nanostructures special processes utilising super critical resist drying can be used. Processes using megasonic assisted development are also available. In addition to these ready-to-use processes AMO also offers on request the development of EBL processes for the special needs of our customers.

 

  • Lithography for sub 10 nm resolution
  • Arbitrary nanopattern generation
  • Master and Template fabrication for Nanoimprint Lithography
  • lithography for high aspect ratio nanostructures
  • nanostructures for biotechnology

Download E-beam Fact Sheet

 

Technology and Equipment

AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m²: Nanolab AMICA. Here, high end fabrication equipment for semiconductor technology is operated in a flexible way to enable quick process changes and unconventional solutions.

  • Substrate materials: Silicon, SOI, Quartz, Sapphire etc., sizes ranging from 10x10 mm² up to 6"
  • Electron Beam Lithography, UV-Nanoimprint Lithography, Photolithography and Holography.
  • Etching processes for Silicon, SOI, Quartz, Glass, Ta2O5, Si3N4, Sapphire, Al, Ti, TiN and many more.  
  • Thin-film deposition processes (CVD, PVD, ALD) of Al, Cr, W, Ti, TiN, Si, SiO2, Ta2O5, Al2O3, AlN and others.
    We have coated wafers in stock.
  • automated SEM-inspection, scanning probe microscopy, automated defect analysis, high-end electrical characterization and many more.

Download Equipment Fact Sheet

 

Gallery

thin film coating

special substrates

chip fabrication

Ebeam Lithography for
sub-10nm lines

 microfabrication

integrated circuit prototyping

3D micro-lens array

photonic crystal device

 SOI photonic circuits

FinFET/Triple-Gate
Technology

grids and gratings up to 6"

 nano bio interface

 

 

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